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Silicon microstructures inc Source: en.wikipedia.org/wiki/Silicon_microstructures_inc

Elmos Semiconductor SE
Company typePublic company
SDAX
IndustryElectrical engineering
Founded1984
Headquarters
Dortmund
,
Germany
Area served
automotive
ProductsSemiconductors, microstructures
SubsidiariesSilicon Microstructures
Websitehttp://www.elmos.de/
Footnotes / references
Garnter ranked #2 Automotive ASIC Supplier

Elmos Semiconductor SE is a German manufacturer of semiconductor products headquartered in Dortmund, Germany. Elmos supplies automotive application-specific integrated circuits (ASICs).

History

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  • 1984 - Founded in Dortmund, Germany
  • 1985 - 32 employees, 0.4 M DM turnover, Installation of 4" Wafer Fab in Dortmund
  • 1994 - DIN ISO 9001 certificate
  • 1998 - 460 employees, 140 M DM turnover. Complete supply from new 6" line
  • 1999 - IPO to new market, Frankfurt
  • 2001 - 630 employees, 107 million Euro turnover Acquisition of Eurasem (Packaging, NL) and SMI (MEMS, USA)
  • 2002 - TS16949
  • 2005 - Opened 8" wafer fab in Duisburg as second production line
  • 2020 - Conversion of legal form into a Societas Europaea[1]
  • 2022 - media reports about possible Chinese takeover[2] which the German government eventually vetoed[3]

Silicon Microstructures acquisition and sale to TE Connectivity

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Silicon Microstructures, Inc.(SMI) was founded in 1991 as a commercial source of high-performance silicon pressure sensors, including Microelectromechanical systems sensors, and accelerometers. Its first product was a silicon sensor for very low-pressure usage.

Elmos Semiconductor acquired SMI in March 2001 from OSI Systems.[4] SMI began production on higher performance, system level sensors and microstructures, wireless, RF and bus addressable microstructures.

In August 2002, SMI acquired the IC Sensors' wafer fabrication operations and wafer R&D group and relocated to Milpitas, California. The following year, Silicon Microstructures undertook a significant and complete wafer fabrication upgrade to expand the facility for full 6" wafer handling. This facility processed primarily 6 inch wafers and has advanced technical capabilities including deep reactive ion etching (DRIE) and plasma enhanced fusion bonding.[clarification needed]

In 2019, Elmos announced the sale of Silicon Microstructures to TE Connectivity, and the subsequent closure of Elmos Group’s micromechanics division.[5]

References

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  1. ^ "Öffentliche Bekanntmachung RegisSTAR".
  2. ^ "Germany likely to block Chinese takeover of Elmos' chip production". Reuters. 2022-11-07. Retrieved 2023-05-09.
  3. ^ Rinke, Andreas; Murray, Miranda (10 November 2022). "Germany blocks Chinese stake in two chipmakers over security concerns". Reuters.
  4. ^ "OSI Systems sells subsidiary SMI to Elmos Semiconductor" (Press release). March 13, 2001. Retrieved 2 September 2016.
  5. ^ "Elmos to sell Silicon Microstructures to TE Connectivity" (Press release). September 23, 2019. Retrieved 17 December 2024.
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